Journal Papers/学術論文誌

  1. K. Shiba, T. Omori, K. Ueyoshi, S. Takamaeda-Yamazaki, M. Motomura, M. Hamada, and T. Kuroda,
    “A 96-MB 3D-Stacked SRAM Using Inductive Coupling with 0.4-V Transmitter, Termination Scheme and 12:1 SerDes in 40-nm CMOS,”
    IEEE Transactions on Circuits and Systems-I: Regular Papers (TCAS-I), vol. 68, no. 2, pp. 692-703, Feb. 2021.
  2. K. Shiba, T. Omori, M. Usui, M. Hamada, and T. Kuroda,
    “Area-Efficient Multihop Inductive Coupling Interface for 3D-Stacked Memory With 0.23-V Transmitter and Sub-10-μm Coil Design,”
    IEEE Solid-State Circuits Letters (SSC-L), vol. 3, pp. 370-373, 2020.
  3. K. Shiba, C. Cheng, M. Hamada, and T. Kuroda,
    “2.5D integration using inductive-coupling TSV-less miniature interposer achieving 317 Gb/s/mm2, 1.2 pJ/b data-transfer,”
    JSAP Japanese Journal of Applied Physics (JJAP), vol. 59, no. SG, pp. SGGL06, Apr. 2020.
  4. K. Shiba, M. Hamada, and T. Kuroda,
    “3D system-on-a-chip design with through-silicon-via-less power supply using highly doped silicon via,”
    JSAP Japanese Journal of Applied Physics (JJAP), vol. 59, no. SG, pp. SGGL04, Apr. 2020.

International Conference Papers/国際会議発表

  1. T. Omori, K. Shiba, A. Kosuge, M. Hamada, and T. Kuroda,
    “A Physical Verification Methodology for 3D-ICs Using Inductive Coupling,”
    IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), Dec. 2021, accepted.
  2. S. Shibata, R. Miura, Y. Sawabe, K. Shiba, A. Kosuge, M. Hamada, and T. Kuroda,
    “A 5-GHz 0.15-mm2 Collision Avoidable RFID Employing Complementary Pass-Transistor Adiabatic Logic with an Inductively Connected External Antenna,”
    IEEE Asian Solid-State Circuits Conference (A-SSCC), Nov. 2021.
  3. K. Shiba, T. Omori, M. Hamada, and T. Kuroda,
    “Area-Efficient Multi-Hop Inductive Coupling Interface for 3D-Stacked Memory with 0.23-V Transmitter and Sub-10-μm Coil Design,”
    IEEE European Solid-State Circuits Conference (ESSCIRC), Sep. 2021.
  4. R. Miura, S. Shibata, M. Usui, K. Shiba, A. Kosuge, M. Hamada, and T. Kuroda,
    “A bonding-less 5-GHz RFID module using a 300um x 300um IC chip,”
    JSAP International Conference on Solid State Devices and Materials (SSDM), pp. 686-687, Sep. 2021.
  5. T. Omori, K. Shiba, M. Hamada, and T. Kuroda,
    “Sub-10-μm Coil Design for Multi-Hop Inductive Coupling Interface,”
    ACM Asia and South Pacific Design Automation Conference (ASP-DAC), pp. 99-100, Jan. 2021.
  6. K. Shiba, T. Omori, M. Hamada, and T. Kuroda,
    “A 3D-Stacked SRAM Using Inductive Coupling Technology for AI Inference Accelerator in 40-nm CMOS,”
    ACM Asia and South Pacific Design Automation Conference (ASP-DAC), pp. 97-98, Jan. 2021.
  7. K. Shiba, T. Omori, M. Okada, M. Hamada, and T. Kuroda,
    “Crosstalk Analysis and Countermeasures of High-Density Multi-Hop Inductive Coupling Interface for 3D-Stacked Memory,”
    IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), Dec. 2020.
  8. K. Ando, K. Shiba, K. Akatsuka, C. Cheng, T. Arakawa, M. Hamada, and T. Kuroda,
    “A 50 Mbps/pin 12-input/output 40 nsec Latency Wireless Connector Using a Transmission Line Coupler with Compact SERDES IC in 180 nm CMOS,”
    IEEE International Conference on Electronics Circuits and Systems (ICECS), Nov. 2020.
  9. K. Shiba, T. Omori, K. Ueyoshi, K. Ando, K. Hirose, S. Takamaeda-Yamazaki, M. Motomura, M. Hamada, and T. Kuroda,
    “A 3D-Stacked SRAM Using Inductive Coupling with Low-Voltage Transmitter and 12:1 SerDes,”
    IEEE International Symposium on Circuits and Systems (ISCAS), Oct. 2020.
  10. M. Usui, K. Shiba, M. Hamada, and T. Kuroda,
    “3D Integration of Ka-band RFIC by Inductive Inter-chip Wireless Communication Using Figure-8 Coils,”
    IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Oct. 2020.
  11. C. Cheng, K. Shiba, M. Hamada, and T. Kuroda,
    “2.5D Integration Using Inductive-Coupling TSV-less Miniature Interposer Achieving 317Gb/s/mm2, 1.2pJ/b Data Transfer,”
    JSAP International Conference on Solid State Devices and Materials (SSDM), pp. 517-518, Sep. 2019.
  12. K. Shiba, M. Hamada, and T. Kuroda,
    “3D SoC Design with TSV-less Power Supply Employing Highly Doped Silicon Via,”
    JSAP International Conference on Solid State Devices and Materials (SSDM), pp. 515-516, Sep. 2019.

Domestic Conference Papers/国内会議発表

  1. 柴康太, 宮田知輝, 門本淳一郎, 天野英晴, 黒田忠広,
    “ThruChip Interfaceの設計自動化,”
    情報処理学会 全国大会, Mar. 2018.

Awards/受賞

  1. Best Student Paper Award, IEEE International Conference on Electronics Circuits and Systems (ICECS), Nov. 2020.
  2. IEEJ Tokyo Branch Student Encouragement Award, The Institute of Electrical Engineers of Japan, Mar. 2018.

Scholarship/奨学金

  1. The University of Tokyo Toyota-Dwango Scholarship for Advanced AI Talents (東京大学トヨタ・ドワンゴ高度人工知能人材奨学金), 東京大学, Apr. 2021 – Mar. 2022.
  2. Japan Student Services Organization Scholarship (Repayment Fully Exempted), Japan Student Services Organization, Arp. 2020 – Mar. 2021.
  3. Nagoya-Mitakai Scholarship (名古屋三田会奨学基金), 慶應義塾大学, Apr. 2018 – Mar. 2019.

Graduate Thesis/学位論文

Funding/競争的資金

  1. K. Shiba, “Efficient Architecture of 3D-Stacked AI Chips,” JST ACT-X Grant Number JPMJAX210A, Oct. 2021 – Mar. 2024.
  2. K. Shiba, “TSV-less 3D-Stacked SRAM,” JSPS KAKENHI Grant Number 21J11729, Apr. 2021 – Mar. 2023.

Media Appearances/メディア報道

  1. ”半導体復活のチャンスをオープンとクローズの両戦略で生かす。,”
    テレスコープマガジン, 2021年5月7日.